The 6th edition of AMI"s Multilayer Packaging Films conference will take place in Chicago from 2-3 June 2015
AMI, Wyomissing, PA, 17th December 2014 - Applied Market Information has unveiled the program for the 6th North American edition of its Multilayer Packaging Films conference. Taking place in Chicago, the leading location for packaging in the USA, this event is expected to continue to attract attendees from across the global supply chain to discuss the latest developments in flexible packaging.
Flexible packaging is a dynamic and constantly evolving market, and worldwide, the way in which consumers view and interact with packaged products is changing. With a growing focus on convenience, value and sustainability, traditional packs continue to be substituted for innovative and flexible options designed to meet these consumer needs.
AMI has gathered an expert panel of speakers to discuss the latest trends, technologies and innovations in this constantly evolving sector. In the opening session, Nova Chemicals will evaluate the change from monolayer to multilayer coextrusion, Packaging Technology & Research will discuss how to leverage innovation through the packaging value chain and AMI will provide an update on the flexible packaging market.
Sustainability is an increasingly important subject for the industry. The audience will hear from Natura Cosmeticos about the eco innovation it is adopting for its brands, Plantic Technologies will present on biobased barrier films and Next Generation Recycling Machines will talk on the challenges in plastic film recycling when moving to a circular economy.
There are ongoing innovations in specialty packaging formats to improve the customer experience. At the conference, presentations will include General Mills sharing the design challenges of clear packaging for food products, Clear Lam Packaging on its stackable, recloseable package and Bemis North America examining the latest innovations in absorbent packaging.
Other key topics being explored at Multilayer Packaging Films 2015 include developments in multilayer films for pharmaceutical blister packaging (Perlen Packaging); pulsed power surface treatment (Southwest Research Institute); micro- and nanolayered polymer film systems (PolymerPlus); electron beam technology (ebeam Technologies) and many more.
AMI"s Multilayer Packaging Films 2015 is relevant for all members of the supply chain including brand owners, retailers, packaging companies, researchers, materials and manufacturing experts. In addition to delivering quality papers, the conference also offers superb and cost-effective networking opportunities with its extensive table top exhibition area.
The full program can be found on AMI's website: www.amiconferences.com. For further information on attending, exhibiting or sponsoring this event please contact Amanda Schaeffer, Conference Coordinator, at email@example.com or +1 610 478 0800.